I. Introduction
Packaging plays a major role in the overall performance of power semiconductors and power modules. The traditional wire bonded approach has been widely used across a variety of packages. It is an established, cost-effective, flexible process with proven assembly infrastructure. However, the wire bonded package requires large number of source wires, in order to lower RDS(ON) or increase power density [3]. The increased number of source wires negatively affects productivity and material cost (Au wire).art