Study on preparation process of Au80Sn20 eutectic solder on thin film substrate

In this work, the Au80Sn20 thin film solder was successfully prepared by mixed thermal evaporation in Au. The main properties of AuSn, AuSn
₂
, and AuSn
₄
intermetallic compounds produced by Au/Sn interdiffusion at room temperature were analyzed from the diffusion mechanism. The manual eutectic welding machine was used for welding and the solder composition was measured. Under the welding temperature of 380°C for 10s, the area of the hole was effectively controlled to be less than 10%, and the shear strength of the sample meets the related technical requirements.