Research on LTCC - based Flat Optocoupler Assembly Technology

A planar optocoupler assembly technology based on low temperature co-fired ceramic (LTCC) technology is proposed. The LED and the phototool are assembled into the LTCC substrate. The electrical interconnection is completed by the Auger ball bonding, And reflective plastic, the formation of surface-mount devices adapted to hybrid circuits. Through the application in the sample circuit, the planar optocoupler is suitable for high-density assembly, which can achieve the electrical isolation between the input and the output of the DC/DC module.