Stress and strain Analysis of LTCC substrate Module based on Microchannel

In this paper, the thermal stress-strain analysis of low-temperature cofired ceramic substrate with microchannel is carried out. Firstly, the finite element analysis model of microchannel LTCC substrate is established, and the thermal stress-strain analysis is carried out. The stress and strain results of LTCC substrate module with three microchannel structures of echo and line type were analyzed by single factor analysis of LTCC substrate with straight row microchannel structure. The length and width of cross section of microchannel were analyzed respectively. Effect of structural parameters of microchannel spacing on stress and strain of substrate modules It provides a theoretical basis for the reliability design of the new cooling micro channel technology.