Interconnection Reliability for MCM of Large Micromirror Arrays and High Voltage Driving ASIC Based on High-density Substrate

In this paper, the insulation performance for 2D-MCM (MMA and HV-ASIC) has been presented. Firstly, the theoretical method was used to calculate and analyze the insulation resistance. Secondly, the insulation resistance of the entire packages was simulated by using COMSOL Multiphysics software. Finally, the measurement of the interline and inter-layer insulation resistance were conducted. The results showed that the inter-layer insulation resistance is higher than 300 MΩ at 100 V and 100 MΩ at 200 V, which is close to the simulation results. With the increase of line space, the inter-line insulation resistance does increase, which is consistent with theoretical calculations. When the line space is 5μm, the inter-line insulation resistance is higher than 610GΩ.