Assessment of Fallouts of the Thermal Step Method for measuring Space Charge in Liquid Dielectrics

This focuses on studying the applicability of the Thermal Step Method (TSM) in liquid dielectrics. The TSM is widely used on solid dielectrics, in which thermal conduction prevails. Experimental results and numerical simulations are employed to study the use of the TSM in dielectric liquids, particularly with respect to liquid convection and permittivity variation with temperature.