Effects of the Adhesion Strength on the Bending Fatigue Behavior of Cu Pattern Laminated Fabrics Using B-Stage Non-Conductive Films (NCFs)

In this study, the effects of the adhesion strength on the bending fatigue properties of Cu pattern laminated fabrics were investigated. Cu pattern was laminated onto polyester fabrics using the B-stage non-conductive films (NCFs). In order to improve the adhesion strength, a coupling agent was treated. The bending properties of Cu/NCFs/fabric laminates were evaluated using a dynamic bending fatigue test, and the effects of NCFs moduli and adhesion strengths on the Cu bending fatigue behavior were investigated. When the coupling agent was directly treated onto the fabrics, the adhesion strength was significantly improved with a little change in the modulus properties and theoretical bending stresses. By using coupling agent-treated fabrics, the numbers of dynamic cycles to Cu pattern failure increased. Cross-section SEM analysis and digital image correlation (DIC) method were used to investigate the effects of adhesion improvement on the Cu pattern failure modes and the actual bending strain applied on the Cu pattern during the dynamic bending test.