Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages

As 4th industry revolution becomes realization, more sophisticated mobile sets and servers are demanded that, in turn, necessitates advanced package technologies. For mobile applications, Package on package (POP) and interposer POP have been widely used. When a laminate organic substrate is replaced by wafer level process, the electrical and thermal performances are greatly enhanced. However, a significant cost is added due to new wafer-level packaging equipment. For network systems and high-performance computing server applications perspective, a silicon interposer is increasingly adapted to integrate HBM (High-Bandwidth Memory) with various controller or logic devices. The merits of fine line and space design rule of silicon interposer cannot be found in any other package platforms. However, the silicon interposers suffer from costly TSVs and the lossy substrate which limits electrical performance. In this paper, three RDL based platforms (FO-PLP, FO-SIP and RDL Interposer) are introduced. An adequate platform can be chosen by considering package size (FO-PLP for mobile applications), thermal performance (FO-SIP for intelligent devices in near-future), competitive cost (RDL Interposer for servers as in consumer products). Nevertheless, RDL based platforms and 2.5D silicon interposer are not cannibalizing one another.