Wide-Range 2D InP Chip-to-Fiber Alignment Through Bimorph Piezoelectric Actuators

A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 µm2 misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.