A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration

A new Wafer Level System-in-Package (WLSiP) has been designed and developed where Application Processor (AP), Low Power Double Data Rate 4 (LPDDR4) memory, and Power Management Integrated Circuit (PMIC) semiconductor technologies as well as passive components are integrated using High-Density Fan-Out (HDFO) packaging technology. Compared to current laminate substrate based packaging technology, this solution shows 87% reduction in substrate thickness, 6.7°C lower temperature on the AP chip and 10% enhancement of the electrical performance.