In-Plane Orientational Control of Electronic Components Using Pattern Complementarity in a Self-Assembling System

In this study, we developed and demonstrated a method for assembling directional electronic components using fluidic self-assembly technology. Using asymmetric patterning of low-melting-point solder, we controlled the directionality of light-emitting diodes (LEDs) stochastically moving and bonded to a substrate in a shaking vessel. The bonding pattern was designed based on a set of dots arranged according to designated rules such that the bonding force of correct bonds (bonds in the correct direction) is sufficiently large compared with that of erroneous bonds (bonds in the incorrect direction). We show that our design rule for solder patterns is effective in realizing directionally selective bonds by demonstrating the correct alignment of LED-bearing model components on the patterned substrate. [2023-0059]