Total ionizing dose effects on analog performance of 65 nm bulk CMOS with enclosed-gate and standard layout

High doses of ionizing irradiation cause significant shifts in design parameters of standard bulk silicon CMOS. Analog performance of a commercial 65 nm CMOS technology is examined for standard and enclosed gate layouts, with Total Ionizing Dose (TID) up to 500 Mrad(SiO
₂
). The paper provides insight into geometrical and bias dependence of key design parameters such as threshold voltage, DIBL, transconductance efficiency, slope factor, and intrinsic gain. A modeling approach for an efficient representation of saturation transfer characteristics under TID from weak through moderate and strong inversion and over channel length is discussed.