BGA strip warpage induced by assembly process and the practical prediction methodology

Understanding and predicting warpage behavior during backend process is key to avoiding workability issues during manufacturing and later reliability issues during testing or during the device operational lifetime. To achieve this several challenges are encountered amongst which are the various temperature loadings that the material has to go through during processing. These temperature loadings can have different effects on warpage. This paper deals with understanding how different assembly processes can effect warpage with particular focus on the ball attach reflow assembly process.