Emerging fine line panel level fan out technology

Advanced packaging technologies, such as 3D/2.5D IC and fan out, etc. has been changing the game rule of semiconductor chain, and blurring the boundaries between foundries and OSATs. Wafer level fan out package has been getting lots of attention since tsmc's InFO technology adopted for the flagship smartphones in 2016. Industry is working further on converting wafer level fan out to panel level fan out to achieve higher productivity and realize fine line interconnection and heterogeneous integration. Powertech Technology Inc. was the first company to setup the fine line trace and large panel level fan out solution in the world. This paper introduced the benefits, challenges and visions of this emerging package technology.