STI scratch defects reduction by using solid pad in 1X technology node

CMP scratch defects reduction plays an important role in yield improvement. In this paper, pad debris reduction and solid pad evaluation are applied to reduce scratch formation. Novel solid pad with high removal rate and less dressing amount demonstrate the good performance of scratch defects generation and get the better productivity. As compared to POR fully dressing on porous pad, scratch defect density greatly reduces 65% by using partial dressing on solid pad.