Modeling of single arm poly silicon actuator gripper with constant heat flux boundary conditions and stress analysis

This paper presents modeling, simulation and stress analysis on micro-gripper with constant heat flux applied. The device is symmetric in geometry, so one side of the device is designed. When electric potential is applied, temperature increases in poly silicon resulting in displacement of the material. The displacement of micro-gripper arm is used for manipulating micro particles. The displacement involves coupled physics i.e. electric current conduction, heat conduction with heat generation and change in structure due to stress and strain. FEA simulation is carried out to verify the design and stress analysis is done.