Contents I. Introduction
With ever increasing demand for higher integration and performance, system-in-package (SiP) are envisioned as one of the most promising technologies to continue “More than Moore” scaling. By integrating more than one chip in a package, the heat effect of chips, mismatch of coefficients of thermal expansion between dielectric substrate and interlayer metal, and external high power electromagnetic pulse can induce many reliability issues in SiP. Therefore, multi-physics effects evaluation becomes one important task for SiP reliability analysis [1]–[5].
