Finite element analysis and optimization for PBGA package

The size of the plastic ball grid array (PBGA) package is getting smaller, and the problem of delamination in packaging has become more important. Therefore, in this study, the packaging process is improved through the finite element analysis (FEA) to analyze the delamination in the packaging components. First, the model of sealing and lamination is built through uniform design method (UDM) with Kriging model and response surface methodology (RSM). Then, the differences between these methods are investigated. The optimal parameters are obtained by UDM and RSM that the mold pressures are 31.7 and 42.57 MPa, temperature is 171.61 and 185 °C, and shoulder width is 358.33 and 800 μm, respectively. Due to process factors of sealing and lamination has an interaction with each other, the RSM in this case is more accurate. Therefore, the result obtained by RSM is more appropriate for the process.