Progress in transfer of wafer level packaging to panel format

Next generation technologies require new solutions for the packaging industry as Fan-Out Wafer Level Packaging (FO-WLP) moves to the Panel Format. Redistribution layers (RDL) for next generation need fine line features of sub 5 pm lines and spaces without significant yield loss, and tall copper pillar (>100 pm) plating is requested without increasing the plating time. This simple and straight forward requirement is the providing challenges to the equipment & chemical suppliers in Fan-Out plating technology.