An efficient multi-objective thermal aware routing algorithm 3D network-on-chips

Three-dimensional Network-on-Chip (3D NoC) is gaining popularity among designers due to scalability, higher bandwidth, fault tolerance, and reliability. However, the stacking of multiple dies leads to severe thermal problems due to increase in power density. Unequal traffic distribution across the chip and higher power density result in higher on-chip temperature resulting in performance degradation, increase in leakage power, and circuit failure. In this paper, we propose a thermal-aware adaptive routing algorithm called multi-objective thermal aware routing (MoTAR) to optimize the thermal profile of the 3D chip. Analysis of the simulation results shows that MoTAR algorithm can make the on-chip traffic and thermal distribution more uniform.