Fabrication of infrared thermal emitters with metal meshed filters by the CMOS process

Infrared (IR) thermal emitters with metal-meshed filter were designed and fabricated using standard 0.18-μm CMOS process. The metal-meshed filters were layout on top of micro heaters, and the substrate under the micro heaters were etched for thermal isolation and enhancing heating efficiency. The chip can be heated up to 530°C, and can generate a power density of 7.81mW/cm
²
with a bias of 3V.