Buried wave devices

A new type of acoustic wave device based on buried waves is proposed. Characteristic to the device is that wave guidance is achieved through the use of heavy metal electrodes buried deep inside a piezoelectric substrate. Such as a structure can be realized, for example, with wafer-wafer bonding techniques. In this work, simulations are used to characterize devices consisting of platinum electrodes buried inside lithium niobate substrate. Simulations imply extremely high coupling coefficient up to 25% and very good quality factor.