The reliability study of a kind of solid state power controller (SSPC)

In this paper a kind of SSPC was designed and fabricated using thick film hybrid circuit technology. More than 1000 SSPC products went through the screening test according to GJB2438A. The screening procedure including thermal shock, high temperature power burn-in test, constant acceleration, hermetic sealing test and particle impact noise detection (PIND). Also 1000h life test was applied to samples after the screening test. The internal water vapor content was measured which is far below the requirement of GJB548B.