Liquid epoxy molding compound with high glass transition temperature and high thermal conductivity

The novel liquid epoxy moulding compound (EMC) material with high thermally conductive and good heated resistance was prepared by epoxy, cyanate and alumina filler. Rheological properties, curing behaviors, mechanical and thermal properties of the resultant materials were investigated by rheometer, DSC, SEM, TGA, TMA and DMA, respectively. The results showed that the cyanate ester modified epoxy and its composite with alumina filler made the glass transition temperature over 212.7 °C and the thermal decomposition temperature (5% wt loss) up to 410 °C, indicating that it has good thermal stability. With an increase in Al
₂
O
₃
fillers loading, the coefficient of thermal conductivity rose from 0.21 to 2.87 W/m·K at 90 wt% fillers. This indicated that the novel EMC material has excellent thermally conductivity, which can be used for fan-out wafer level packages.