Electrical Transmission Properties of HBM Interface on 2.1-D System in Package Using Organic Interposer

We propose a 2.1-D SiP that uses an organic interposer for HBM applications and describe a demonstration of the technology. This SiP structure consists of a newly developed thin photosensitive insulation film multilayer (organic interposer) on a conventional organic package, enabling the package cost to be well controlled. An HBM interconnect was achieved in just two signaling metal layers with an L/S of 2/2 μm. The connection between the metal layers was achieved by vias as small as 5 μm in diameter through a very thin photosensitive insulation film layer about 4 μm thick. The electrical transmission properties of the HBM were demonstrated in a simulation. The simulation resultsshow a very good eye opening of up to 3 Gbps.