The solutions for 3D-NAND processes with Canon's latest KrF scanner

The NAND type flash-memory is now used not only on smart phones or tablet PCs, but also adopted on infrastructures such as servers, etc. To enlarge the data capacity, the planer type NAND flash memory will need further miniaturization of the circuit pattern, whereas 3D-NAND allows far more capacity growth per wafer, without stressful miniaturization, since the transistor is formed vertically. However, there are a lot of technical challenges for 3D-NAND processes. In this report, we would like to precisely share Canon's approach, on our lithography scanner system, FPA-6300ES6a, towards the above mentioned challenges, which enables low-cost 3D-NAND flash memory mass-production.