Analysis and modeling of latent defects in the printed conductors

The paper substantiates the necessity of taking into account of hidden (latent) defects printed conductors. Defines the conditions of transition latent defect of the printed conductor in obvious defect, leading to inoperability of the printed circuit board. Allocated technological defect of the printed conductor in the form of cracks and is made analysis of stress-strain state. Specified conditions of overgrowth defect depending on external factors (mechanical stresses). This model allows to perform numerical simulations of the printed circuit board and to determine the conditions for the transition of latent defects (cracks) in obvious defect, depending on the external impact (acceleration). The results of computational experiments have allowed to reveal mechanical stress in the defect zone depending on the size of the printed conductor and external acceleration.