Investigation of Copper–Carbon Nanotube Composites as Global VLSI Interconnects

Applicability of copper-carbon nanotube (Cu-CNT) composites as on-chip global VLSI interconnects is investigated comprehensively. Electrical modeling of Cu-CNT composite interconnects is carried out by virtue of effective complex conductivity. The performances, including time delay and step response, are characterized based on the equivalent circuit model. Finally, the crosstalk effect between coupled Cu-CNT composite interconnects is analyzed.