Improving Delamination Strength by Patterning the Buffer Layers of Coated Conductors

Pulsed lasers were used to drill small holes distributed homogeneously on buffer layers of coated conductors, aiming at improving their mechanical properties. Each hole should be engraved by only one pulse of laser for practicality. The effect of pulsed laser engraving on buffer layers, CeO
₂
in this study, were investigated. The size and depth of the hole can be controlled by adjusting laser parameters. REBa
₂
Cu
₃
O
_y
(REBCO) layers were then grown on the laser patterned buffer. The growth mechanism of REBCO above the drilled holes was studied. In addition, influence of drilled holes on the critical currents of coated conductors were studied. Finally, the effect on mechanical strength of as grown samples were studied by measuring their delamination strength under transverse tension.