Research on thermal coupling effect of multi-heating sources in MCM

Thermal coupling effect between multi-heat sources makes that true junction temperature based on self-heating of chips adds to thermal coupling temperature. This paper focuses on methods of calculation of junction temperature of MCM: thermal resistance network model and thermal resistance matrix model, and making a comparison between these two models. They are established by different way, but this paper will prove the final calculation formulas of these two models represent same physical significance. Then a type of power PWM is as a research object. The two models are verified by infrared thermal imaging and finite element analysis. In the end of this study, thermal coupling laws of multi-heating sources MCM are obtained by above analysis, argument and experiments.