A novel data pattern dependent electromagnetic emission modeling for high speed multi-channel interconnects

Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the electromagnetic emission for the high speed multi-channels on IC packagings. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superpose the contribution of different signal patterns. As a result, with limited pre-calculations, it is very convenient to compute the electromagnetic emission efficiently from different signals with various data pattern combinations, which benefits identifying worst case scenario. This work provides a statistical analysis modeling framework for comprehensive radiation studies. It directly benefits fundamental understandings and guideline designs for IC packaging and PCB EMI reductions.