Development of Doped Silicon Multi-Element Stress Sensor Rosette With Temperature Compensation

In this paper, a developed n-type piezoresistive three dimensional (3D) stress sensor with full temperature compensation is presented. The proposed sensing rosette benefits from the stress insensitivity of the full-circular n-type piezoresistor, oriented over (111) silicon plane, to detect only temperature changes for compensation. Moreover, the unique behavior of shear piezoresistive coefficient (π44) of n-Si is utilized to construct a piezorestive stress sensing rosette over (111) silicon plane that is capable of extracting 3D stress components. A prototype stress sensing chip was microfabricatedto test the capabilityof the developedsensing rosette to accurately extract stress applied on structures at different thermal environments. The fabricated sensing chip was subjected to different mechanical loads using a loading rig with four-point bending fixture. The testing was carried out over a temperature range of 0-50 °C. The results showed that the proposed sensing chip has the capability of capturing the stress applied at different temperatures. Also, the developed sensing rosette showed less sensitivity to the uncertainty in piezoresistive coefficients' values compared to the other developed 3D piezoresistive stress sensors.