New SLIM Package Intelligent Power Modules (SLIMDIP) with thin RC-IGBT for consumer goods applications

This paper presents a new slim package and new RC-IGBT for Dual In-line Package Intelligent Power Modules developed by Mitsubishi Electric for motor control in consumer goods. The RC-IGBT (Reverse Conducting IGBT) integrates the IGBT and FWD into a single chip, which results in an incredible space savings for DIPIPM™ style devices. The SLIMDIP features built-in bootstrap diodes and current limiting resistors so that the only external component required for the high side supplies is bootstrap capacitor. The new SLIMDIP products also provide built-in temperature monitoring with analog feedback to the controller (Fig. 1). The DIPIPM Ver.5 also contains a unique super thin state-of-the-art 600V RC-IGBT CSTBT™ (Carrier Stored Trench-gate Bipolar Transistor) chip. The SLIMDIP is available with a rating of up to 15A/600V, suitable for motor drives up to 1.5kW, in a package area of 32.8mm × 18.8mm.