Developing Cost-Effective Ultrathin Reliable High Power White LED Emitters

A packaging approach for cost-effective and ultrathin high-power phosphor-based white light-emitting-diode (WLED) emitters with outstanding reliability is presented. By removing the encapsulant in the conventional method, the new approach employs a single silicone-phosphor thin layer instead of multiple phosphor layers in chip-scale package (CSP) WLED for both encapsulations, as well as wavelength conversion. It is demonstrated that the presented WLEDs exhibit superior optical and thermal performance and lifetime durability. Accordingly, the present work offers a high reliability, cost-effective alternative approach for ultrathin high power WLED emitters with significant advantages over the conventional packaging structure and chip-scale packaging methods.