Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect - tool features as enablers of unique technology

Thermo-Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. This paper is introducing this technology from the equipment features aspects, as well as from the materials/process aspects. The unique characteristics of the TCB technology over the existing chip attach technology (C2 mass reflow) are discussed in detail. The development of both equipment and processes at ASMPT and Intel resulted in deployment of the technology towards high Volume Manufacturing (HVM). Quality, process and equipment controls are implemented as part of the deployment, and will be discussed in this paper.

Introduction

The packaging roadmap towards higher functionality and ever thinner and smaller devices is introducing an exciting challenge and opportunity for the assembly community. One of the key elements in the assembly process, the chip attach, is the focus of this study.