Effect of microwave hybrid heating on the formation of intermetallic compound of Sn-Ag-Cu solder joints

Microwave hybrid heating (MHH) technique was used for investigate the formation of intermetallic compound layer at Sn-3.0Ag-0.5Cu/Cu interface. 4g and 6g of graphite powder were used as susceptor to provide initial heating of the solder alloy before it starts couple with the microwaves and melted on the Cu surface. The IMCs interface was characterized through Field Emission Scanning Electron Microscope (FESEM), Electron Dispersive X-ray (EDS), X-ray Diffraction (XRD) and nanohardness. Microstructural study showed the formation of Cu
₆
Sn
₅
and Cu
₃
Sn IMCs at the Sn-3.0Ag-0.5Cu/Cu interface after 120s, 150s and 180s microwave heating time. The Cu
₆
Sn
₅
IMC scallop-like and angular trapezoid structure are formed after 180s microwave heating time with 4g and 6g of graphite powder respectively.