Effect of reflow profile parameters on shear performance of Sn3.0Ag0.5Cu/Cu solder joint

The relationship between reflow profile parameters (soak temperature and soak time, reflow temperature and reflow time, cooling rate) and shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated. It was found that soak time, reflow temperature and cooling rate had significant influence on the shear performance of Sn3.0Ag0.5Cu/Cu. Adequately prolong soak time and increase reflow temperature would help to improve the shear force of joint. The fast cooling rate is benefit to improve the shear performance of SAC/Cu joint. However, too fast cooling rate may result in residual stress in solder joint.