Progress in ultrahigh-voltage SiC devices for future power infrastructure

UHV (> 15 kV) SiC PiN diodes and IGBTs with improved on-state performance are presented. Through enhancement of carrier lifetime and optimization of junction termination, a breakdown voltage over 26.9 kV and a differential on-resistance of 9.7 mΩcm
²
were achieved for PiN diodes. Flip-type n-channel IGBTs with a chip size of 8 mm × 8 mm exhibited a breakdown voltage over 16 kV, and 6.5 kV - 60 A switching at 250°C was demonstrated.