Higher Copper Composition Shear Stress Analysis on Lead Free Solder Ball

The reliability performance and structural of the solder joint on the Ball Grid Array (BGA) has become an important concern, due to increasing demand of electronic devices. The reliability of the BGA are evaluated through shear test. Different parameters of the ball shear test will cause the change on stress and strain. In this paper, a simple shear test on a single solder ball joints on Ball Grid Array (BGA) with varied shear speed was simulated. Lead free solder Sn-3.5Ag-0.7Cu is used in this analysis. Simple Single Factor (SSF) experiment for a single factor was used to analyse the load effect on a single solder ball. Simulation of load effects on BGA was accomplished by using ANSYS Version 11. The results in load effect on the single solder joint of BGA was plotted. Result shows that the high shear speed test obtains greater shear forces compare to low shear speed test.