Dielectric and thermal properties of submicrometric epoxy/c-BN composites

In this study, the effect of incorporating submicrometric cubic boron nitride (c-BN) in epoxy resin on the respective thermal conductivities and dielectric responses has been investigated. Epoxy composites with c-BN contents of 1 and 5 wt% have been fabricated and compared to neat epoxy. Broadband Dielectric Spectroscopy (BDS) at several temperatures has revealed only minor increases in real and imaginary parts of the complex permittivity for the 5 wt% c-BN composite, while the thermal conductivity has been improved by more than 25 % compared to neat epoxy. Differential Scanning Calorimetry (DSC) has further been conducted on all samples, showing no major change in the glass transition temperatures after incorporation of c-BN in epoxy.