I. Introduction
With the development of science and technology, the computer and microelectronics industry which represents the forefront of science and technology also increases enormously. As we all know, with the decreasing of chips volumes and increasing of chips performance, the chips' heating value increases constantly. It may cause many serious consequences such as unstable performance of the chip, failure of packaging structural and the burnt of chip if the heat does not dissipate efficiently. Therefore, researches mainly focus on analyzing thermal load of electronic packaging, which directly affects whether the electronic components can work normally[1]