Direct liquid cooling of bare die packages using a microchannel cold plate

A stainless steel direct liquid contact microchannel cold plate is investigated for the thermal management of bare die packages. Experiments are conducted for a prototype microchannel cold plate in contact with a 1.18cm
²
uniformly heated thermal test vehicle. The junction-to-fluid thermal resistance is measured to be 0.21°C/W for a water flow rate of 1 L/min thru the cold plate. Dynamic thermal characterization of the microchannel cooling solution has also been conducted and compared against static models to predict temperature response from a dynamic power profile.