I. Introduction
Optical interconnects with many advantages such as low signal delay, light weight, lower-power consumption, and immunity to electromagnetic interferences have been utilizing in high performance computing (HPC) systems to overcome limitations of electrical interconnects [1], [2]. Short-reach rack-to-rack, board-to-board, and chip-to-chip interconnects, in the HPC systems require high-speed data transmission with the design of high-capacity and compact size pluggable optical modules for full-duplex optical links. Thus, in order to optimize their performance while minimizing cost, optical subassembly (OSA) modules for optical links should be carefully designed.