Thermal radiation material for electronic devices applications

Based on the thermal dissipation issues of electronic devices, a novel thermal radiation material (TRM) using specific ceramic powder and polymer composite technology was developed. This material presented the advantages of high infrared ray emissivity, electrical insulation, and environment reliability. The thermal emission spectra wavelength was covered from middle to far infrared ranges. The emissivity was higher than 90% between 4~14μm wavelength. To realize the effect of heat dissipation of thermal radiation material, thin film was obtained by coating this composite on the heat sink of 13 watts LED bulb. After drying process, the dissipation properties were evaluated by thermometer. MCPCB temperature of coating LED bulb would be decreased 13.5 degree Celsius which was lower than un-coating one. And the heat sink temperature of coating LED bulb was decreased about 8 degree Celsius. Furthermore, the lumens were also investigated. Due to the decreasing of LED temperature, the lumen per watts was increased over 14%. These characteristics made them suitable for electronic devices applications in handheld products, LED, heat sink coating, projector, industry computer, and cloud equipment.