Deep Learning-Based Positioning Error Fault Diagnosis of Wire Bonding Equipment and an Empirical Study for IC Packaging

Little research has been done for artificial intelligence applications of semiconductor backend. This study aims to develop a deep learning based fault diagnosis framework as prognostics and health management (PHM) solutions with a comprehensive analytics process. A linear encoder sensor is employed to measure position, while data preparation is conducted to convert position information into a signal. Then, signal processing is used to extract the features, in which high pass filter is applied to normalize the signal and emphasize the features. High-dimensional features including time domain statistical features, time-frequency domain features obtained by continuous wavelet transform (CWT), and frequency domain features converted by fast Fourier transform (FFT) are extracted to prepare the dataset. An ensemble neural network model that integrates deep neural network (DNN) and convolutional neural network (CNN) is employed to recognize the pattern and diagnose the positioning errors. The accuracy and false alarm rate are considered to support maintenance decisions. An empirical study was conducted in a world leading IC assembly and testing company for validation. The results have shown that the proposed approach can effectively detect inappropriate installation of the bond head in wire bonding equipment for predictive maintenance and cost reduction.