Research on MMC Improved Sub-Module Topology With DC Fault Ride-Through and Negative Level Output Capability

Modular multilevel converter (MMC) is a modern and preferred topology among the voltage source converters (VSCs) in high voltage direct current (HVdc) transmission. However, the traditional half-bridge sub-module (SM) cannot block the dc fault current. Hence, the novel SM topology with dc fault ride-through capability is introduced. This article proposes an improved diode-clamp SM (IDCSM) structure. Based on the DCSM topology, the two capacitors’ connection in the IDCSM is modified to operate independently and generate output voltage levels of
$- u_{c}$
, 0,
$u_{c}$
, and
$2u_{c}$
based on the additional switching devices. The IDCSM with dc fault ride-through and negative level output capability can increase the number of output levels and significantly reduce hardware cost. In addition, this article adopts an equivalent half-bridge modulation (EHBM) strategy that can modulate all the MMC SM topologies with the comparison algorithm, simplifying the complicated logic calculation process. Then the IDCSM power loss, cost, and dc fault ride-through characteristics are illustrated in detail. Finally, the simulation and experimental results verify the feasibility of the proposed IDCSM topology and EHBM.