I. Introduction
Tremendous increase of computational power and miniaturization of portable devices as well as preference for wireless solutions are currently driving the development in the next generation of ultrasonic diagnostic instrumentation [1], [2]. At the same time, the imaging quality depends on the quality of the ultrasonic transducer that still constitutes the main component of every ultrasonic system. On the other hand, many new products require special attention to costs not only at the production level but also even at the prototyping phase. Therefore, transducer quality needs to be accompanied by the cost-effectiveness of the solution in order to truly enable excellent imaging quality as well as breakthrough cost reduction.