Modeling and Quantification for Electromagnetic Radiation of Power-Bus Structure With Multilayer Printed Circuit Board

The ground bounce noises in a power distribution network of multilayered stack-ups in electronic packages and boards will cause simultaneous switching noise coupling, high insertion loss degradation of signal via, and stray radiation. These lead to signal integrity, power integrity, and electromagnetic compatibility problems. This paper presents an efficient numerical method for evaluating the radiation emission from power-bus structure in complex electronic packaging of high-speed integrated circuit system. It is based on the discretization technique and the boundary integral equation. First, the variational field distribution on the peripheral surfaces of power-bus structure induced by the return current is calculated by using the Helmmholtz equation and boundary conditions. The peripheries of power-ground (P/G) planes and via are discretized into small elements. Then, the changing transient impedance at the edge of antipad plate caused by displacement current through P/G planes is calculated with the assumptive exciting current 1 mA. Finally, the far field radiation is obtained through equivalent magnetic current of edge field. Cavity-model analysis is used to verify, and the good agreement with the theoretical prediction validates the correctness and efficiency of the present analysis.