High-Temperature Constitutive Behavior of Electroplated Copper TGV Through Numerical Simulation

A reliable constitutive model for copper is important for simulating the thermomechanical behavior of copper through glass via (TGV) in the glass interposer. This study presents a time-hardening model for the electroplated copper TGV. The material constants of copper in this model are evaluated by optimizing the experimental and numerical simulation results. In the experiment, the in-plane displacement of the glass was measured using 2-D digital image correlation (DIC). The four material constants in the time hardening model (THM) were adjusted to ensure good agreement between the simulation results and the experimental results. This optimized THM can be applied to copper TGVs over a wide range of temperatures (25 °C–400 °C) and temperature ramp rates (4–50 °C/min).