Reliability Inspection for Bilayer Nanosilver Paste Ensemble Pressureless Sintered Embedded Cooling SiC Power Module

Various hollowing substrates have been invented to equipped in the embedded cooling power modules. Through a lower stress residue, multilayer nanosilver paste ensemble pressureless sintering to obtain the qualified thermal interface material (TIM) joints becomes an essential process for those fragile stacking packages. As the Anand viscoelastic constitutive model prediction, the maximum residual stress inside the TIM joints is only 63.18 MPa, far below the encapsulated materials’ tensile strengths. From all the scanning electron microscope (SEM), X-ray, and scanning acoustic microscope (SAM) image investigations, the upper and beneath nanosilver paste ensemble pressureless sintered TIM joints (50
$\pm ~10~\mu \text{m}$
thickness) contained few cracks and delamination (only 1.6% ± 0.1% and 8.5% ± 0.1% void ratios, respectively). The measured upper and beneath sintered TIM joints’ bond strengths were up to 38 ± 2 and 63.8 ± 2 MPa, higher than the industry requirement (30 MPa), respectively. After 21 000 power cycles, the upper and beneath sintered TIM joints’ thermal resistance increased only by 10.3% and 5.3%, far underneath the failure standard (20%), respectively. This presented multilayer nanosilver paste ensemble pressureless sintering process is a promising technology for the embedded cooling power module stacking package.